The SICK UD18 Series Ultrasonic Distance Sensor is especially well suited for detection of layered materials, as well as splices, utilizing ultrasonic pulse technology. Materials double layer detection is commonly used for includes paper, cardboard, metal and transparent plastics. This sensor family enables parameterization of up to four individual levels of sensitivity, with switching capability during operation. Switching frequencies go up to 100Hz depending on variant, for compatibility with high speed systems. This versatility allows reliable detection of layers in even fully adhered materials. Additional adjustment and visualization options possible via Sick's Connect+ Software.
Applications
• Double layer detection for paper, cardboard, film, sheet metal, wafers, PCBs, and chip cards
• Checking material transportation upstream of presses, printing machines, and cutting machines
• Splice and label detection
• Packaging, processing, printing, paper, electronics, solar, metal, automotive, and supply industries